Increased Capacity – Piece by Piece

	Laser diode packaging		Clean room facility at LC in Olching Germany
	Eight Element VCSEL Array		Various packages of NIR lasers

In addition to the complete production line of IV-VI laser diodes, we are in a position to process III-V semiconductor materials. For this, we have a number of different dicing techniques at our disposal, as well as bonding and solder stations, and capping capabilities. We also have comprehensive measurement technology and burn-in stations at our disposal, as well as experience in handling various types of laser diodes (quantum cascade laser diodes, VCSELs, and high power laser diodes). We also have the capability of coating laser facets in house.

Why invest the time and effort?

A specialization has taken place in the semiconductor industry. Many wafer fabs do not have the capacity to package their own materials any more, but have outsourced products to the Far East to be capped in large quantities. However, customer demands for specific components often go unfulfilled in this way. The products offered by LASER COMPONENTS help to bridge this gap. We either procure the necessary components through our large network or use those provided by customers and process their wafers, bars, chips, or lasers on submounts. We have experience in the development of different open and hermetically sealed housings and in the integration of thermoelectric coolers.
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