Holo/OR Deep Cleave

LASER COMPONENTS presents Holo/OR’s DeepCleave module, a completely optical solution for cutting transparent materials, such as flat panels for mobile phones. A system of lenses with a diffractive optical element is used to focus a single-mode laser beam and create a stretched focus line of 2 mm in beam direction (Z-axis). This 1.8 µm diameter area features uniform intensity distribution.

Embedded in a tube, the DeepCleave system corresponds to a lens with a numerical aperture of 0.35 and can be used immediately. Additional lenses or expensive optics are not required. Together with a DOE from Holo/OR, the DeepCleave module also comprises the sophisticated optical system required to generate the long focal line with constant power density. To achieve this, an input beam with a precisely defined size and a small M² is required.

In mass production of glass for cell phones, displays, solar cells and other high-end ­applications­, long, precise cuts have to be made within a very short time. Cut rates of over 500 mm per second are not uncommon, with cut quality having a decisive influence on the flexibility and durability of the resulting components. Lasers with a uniform line on the Z-axis can penetrate deep into the material and deliver optimum results.

Further product information:
Diffractive Optical Elements for Beam Shaping

Manufacturer:
Holo-OR Ltd.

Contact:

Contact Person:	Lukasz Abramek
Company:	Laser Components Germany GmbH
Address:	Werner-von-Siemens-Str. 15
ZIP / City:	82140 Olching
Phone:	+49 (0) 8142 6544-010
Fax:	+49 (0) 8142 2864-11
Email:	lukasz.abramek@lasercomponents.com