Cutting Thick Glass with a Laser
Holo/OR Deep Cleave
LASER COMPONENTS presents Holo/OR’s DeepCleave module, a completely optical solution for cutting transparent materials, such as flat panels for mobile phones. A system of lenses with a diffractive optical element is used to focus a single-mode laser beam and create a stretched focus line of 2 mm in beam direction (Z-axis). This 1.8 µm diametre area features uniform intensity distribution.
Embedded in a tube, the DeepCleave system corresponds to a lens with a numerical aperture of 0.35 and can be used immediately. Additional lenses or expensive optics are not required. Together with a DOE from Holo/OR, the DeepCleave module also comprises the sophisticated optical system required to generate the long focal line with constant power density. To achieve this, an input beam with a precisely defined size and a small M² is required.
In mass production of glass for cell phones, displays, solar cells and other high-end applications, long, precise cuts have to be made within a very short time. Cut rates of over 500 mm per second are not uncommon, with cut quality having a decisive influence on the flexibility and durability of the resulting components. Lasers with a uniform line on the Z-axis can penetrate deep into the material and deliver optimum results.
Further product information:
Diffractive Optical Elements for Beam Shaping
Manufacturer:
Holo-OR Ltd.
Contact:
Contact Person: | Samuel Thienel |
Company: | LASER COMPONENTS (UK) Ltd. |
Address: | Goldlay House 114 Parkway |
Postcode / City: | CM2 7PR Chelmsford Essex |
Phone: | +44 1245 491499 |
Fax: | +44 1245 491801 |
Email: | sthienel@lasercomponents.co.uk |
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